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VIA > Cpus > Cyrix III/C3


Via 1GigaPro 667 BGA - haut.jpg

Via 1GigaPro 667 BGA
Manufacturer VIA
Model C3
Architecture x86
Codename Samuel 2
Core frequency 667 MHz
Package EBGA-368
Physical informations
Package Size 3,5x3,5 cm Manufacturing process 0,15 Ám
Die size 52 mm▓ Transistor count 15200000
Electrical informations
Bus frequency 133 MHz L1 cache (data+instruction) 64+64 KB
Core/Bus ratio 5.0x L2 cache -
Voltage 1.60V L3 cache -
Other informations
Release date Unknown
Functions/Features None
In collection ? yes, in 3 Collections : Mixeur, Molka, Cedrik.




Page created on 07/10/2008